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THE NEW MEDICAL GRADE

The RECOME club aims to bring together players of the medical sector in order to converge the needs of manufacturers of electronic components, medical devices, by creating a new medical grade that will strongly increase the reliability of current and future electronic medical devices.

About

Discover the RECOME Club

About

Discover the RECOME Club

Members

Take a look to our members

Members

Take a look to our members

Articles

In thirst for knowledge? Discover our expert's articles!

Articles

In thirst for knowledge? Discover our expert's articles!

Who are we?

We started this project as on project holder of thre entities, Tame-Component, the LARIS laboratory and Ouest Valorisation

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What are we doing?

We are creating a new medical garde in order to increase the reliablity of the components of electronic medical devices

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How are we doing it?

We are currently in theprocessof creating and implementing thr grade through the help and cooperation of our partners

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Behind RECOME?

Three companies decided to launch RECOME project in order to increase thr reliability of medical devices

The Angevin Systems Engineering Research Laboratory (Laris) brings together researchers from faculties and institutes of the University of Angers ( Polytech-Angers, IUT, Faculty of Sciences and UFR Esthua), the CHU and the Catholic University of West (UCO).

LARIS

Angers

Ouest Valorisation works every day to be the bridge between public research and the socio-economic world. It simplifies and professionalises the transfer of innovations resulting from French academic research to companies.

Ouest Valorisation

Nantes

Created in 2000, the Tame-Component laboratory develops and offers consulting, expertise, analysis and testing services on components for all the major French and European industrial sectors: medical, aerospace, military, etc.

Tame-Component

Saint-Philbert-de-Bouaine

Our blog

Predictive Reliability Modelling Based On Combination Of DoE And ALT

by | 29 November 2024 | Articles | 0 Comments

Fatima-Ezahra Indmeskine presented a paper entitled “Predictive Reliability Modelling Based On Combination Of DoE And ALT” at the ESREL 2024 European Safety and Reliability Conference, held in Krakow, Poland, from June 23 to 27, 2024. This work presents the...
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Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of AIMDs

by | 22 November 2024 | Articles | 0 Comments

During the ESREF 2024, European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, which took place from September 23 to 26, 2024 at Parma in Italy, Fatima-Ezahra Indmeskine presented a paper entitled “Design-of-Experiments and ALT plan for...
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by | 14 March 2024 | Articles | 0 Comments

As part of the RECOME project, we carried out a survey on the various sterilization methods used for medical devices, particularly Active Implanted Medical Devices (AIMD), to identify the needs and constraints of sterilization methods for biocompatibility. The survey...
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by | 27 February 2024 | Articles | 0 Comments

Medtronic, Boston Scientific Corporation, Abbott… but which are the other major IP players in the field of active implantable medical devices with embedded electronics (the "AIMD field") in the world and in France ? Which are the new entrants in France since september...
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Fiabilité des composants électroniques dans les Dispositifs Médicaux critiques et implantables : une question cruciale pour la santé publique, une norme volontaire AFNOR Spec 2311

by | 26 February 2024 | Articles | 0 Comments

Les dispositifs médicaux critiques et implantables sont incontournables dans le traitement et la surveillance des patients, ils représentent une avancée majeure dans le domaine de la médecine. De plus en plus, ces dispositifs intègrent des composants électroniques de...
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by | 25 January 2024 | Articles | 0 Comments

In the preceding article, the FMMEA (failure mechanisms and modes analysis) of chip resistors was discussed, with a focus on defect observation due to high reliability of the components associated with technology maturity, forming the basis of our life tests. This...
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by | 18 January 2024 | Articles | 0 Comments

Failure modes and mechanisms analysis (FMMEA) for chip film resistors Chip film resistors (including thick-film and thin-film chip resistors) may experience failure due to various environmental loads: Mechanical stress which can cause separation of electrodes leading...
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AFNOR SPEC 2311 Launch webinar – A Medical Grade for Electronic Components: replay video now available

by | 9 January 2024 | Articles | 0 Comments

PROJECTTronico (Tame-component), Oticon Médical and LARIS laboratory (University of Angers, France) have joined forces to draft a voluntary AFNOR Spec-type reference document to demonstrate the reliability of electronic components for medical use. This is an...
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by | 8 September 2023 | Articles | 0 Comments

Failure modes and mechanisms analysis (FMMEA) for ceramic capacitors In order to determine the "best" method for testing reliability parameters of electronic components, it is crucial to have a sound understanding of failure mechanisms and failure modes, as well as...
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FIDES 2022 guide now available

by | 6 July 2023 | Articles | 0 Comments

The French version of the FIDES 2022 guide is now available. It replaces the FIDES Guide 2009 edition A. As a reminder, the FIDES Guide is a global methodology for reliability engineering in electronics, and consists of two parts:- a guide to predictive reliability...
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